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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12577681 B1

PDFFull Text
Date of Patent:
Mar. 17, 2026

Filed:

May. 16, 2025

Method for preparing copper-plated titanium alloy wire reinforced aluminum-based composite material

Applicant:

Xi'an University of Technology, Xi'an, CN;

Inventors:

Lisheng Zhong, Xi'an, CN;

Zixuan Dou, Xi'an, CN;

Yanwei Wang, Xi'an, CN;

Tiandong Wu, Xi'an, CN;

Yanqing Zhang, Xi'an, CN;

Jianlei Zhu, Xi'an, CN;

Yunhua Xu, Xi'an, CN;

Assignee:

Xi'an University of Technology, Xi'an, CN;

Attorney:
Primary Examiner:

Dah-Wei D Yuan

Assistant Examiner:

Andrew J Bowman

Int. Cl.
CPC ...
C23C 28/02 (2006.01); C23C 6/00 (2006.01); C25D 3/38 (2006.01); C25D 5/38 (2006.01); C25D 5/50 (2006.01); C25D 7/06 (2006.01);
U.S. Cl.
CPC ...
C23C 28/021 (2013.01); C23C 6/00 (2013.01); C25D 3/38 (2013.01); C25D 5/38 (2013.01); C25D 5/50 (2013.01); C25D 7/0607 (2013.01);
Abstract

The present disclosure discloses a method for preparing a copper-plated titanium alloy wire reinforced aluminum-based composite material, including steps of: etching a cleaned TC4 wire; then electroplating a copper layer to obtain a copper-plated titanium alloy wire; performing heat treatment with two-step slow cooling on the copper-plated titanium alloy wire by using a heat treatment furnace; and, cladding a single-layer and single-pass ER5356 aluminum alloy on an aluminum alloy substrate by an arc additive manufacturing technology, then flatly spreading the heat-treated copper-plated titanium alloy wire in the center of the cladding layer to form an intermediate layer, and finally cladding a single-layer and single-pass ER5356 aluminum alloy matrix on the surface of the intermediate layer. In the present invention, by using copper as a transition interlayer of the aluminum-titanium interface, the generation of brittle intermetallic compounds between aluminum and titanium can be completely suppressed.

Find Patent Forward Citations

Zhong, Lisheng. (2026). Method for preparing copper-plated titanium alloy wire reinforced aluminum-based composite material (U.S. Patent No. 12577681). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12577681

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