The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2026

Filed:

Feb. 04, 2021
Applicant:

National Institute for Materials Science, Ibaraki, JP;

Inventors:

Masanobu Naito, Ibaraki, JP;

Siqian Wang, Ibaraki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 133/14 (2006.01); C08F 220/14 (2006.01); C08F 220/18 (2006.01); C08F 220/30 (2006.01); C09J 4/06 (2006.01); C09J 133/12 (2006.01);
U.S. Cl.
CPC ...
C09J 133/14 (2013.01); C08F 220/14 (2013.01); C08F 220/1808 (2020.02); C08F 220/303 (2020.02); C09J 4/06 (2013.01); C09J 133/12 (2013.01); C09J 2301/416 (2020.08); C09J 2433/00 (2013.01);
Abstract

Provided is a polymer compound having a repeating unit represented by Formula 1A below: wherein in Formula 1A, Zrepresents a hydrogen atom or a monovalent group, Rrepresents a group represented by Formula 1B, Lrepresents a divalent group, n represents an integer of 1 or more, and in in Formula 1B, Lrepresents a single bond or a divalent group, Rrepresents a group selected from the group consisting of a hydroxy group and a group represented by *—OR, Rrepresents a hydrocarbon group which may have a hetero atom, a plurality of R's may be bonded to each other to form a ring, * represents a bonding position, m represents an integer of 1 to 5, and a plurality of L's and a plurality of R's may be the same as or different from each other.


Find Patent Forward Citations

Naito, Masanobu. (2026). Polymer compound, method for producing polymer compound, adhesive composition, cured product, method for producing adhesive composition, and method for adjusting adhesion force (U.S. Patent No. 12577444). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12577444

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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