The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2026

Filed:

Mar. 17, 2021
Applicant:

Yupo Corporation, Tokyo, JP;

Inventors:

Ryota Toyama, Ibaraki, JP;

Hiroshi Koike, Ibaraki, JP;

Assignee:

YUPO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/29 (2018.01); B32B 7/022 (2019.01); B32B 7/027 (2019.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); C09J 7/38 (2018.01); C09J 7/40 (2018.01); B29C 48/00 (2019.01); B29K 23/00 (2006.01); B29K 105/00 (2006.01); B32B 27/18 (2006.01);
U.S. Cl.
CPC ...
C09J 7/381 (2018.01); B32B 7/022 (2019.01); B32B 7/027 (2019.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/302 (2013.01); B32B 27/306 (2013.01); B32B 27/32 (2013.01); C09J 7/29 (2018.01); C09J 7/405 (2018.01); B29C 48/0018 (2019.02); B29K 2023/06 (2013.01); B29K 2023/086 (2013.01); B29K 2023/12 (2013.01); B29K 2105/0097 (2013.01); B32B 27/18 (2013.01); B32B 2250/24 (2013.01); B32B 2305/026 (2013.01); B32B 2307/30 (2013.01); B32B 2307/54 (2013.01); B32B 2405/00 (2013.01); C09J 2301/414 (2020.08); C09J 2423/00 (2013.01); C09J 2423/045 (2013.01); C09J 2423/106 (2013.01); C09J 2425/00 (2013.01); C09J 2425/005 (2013.01);
Abstract

The present invention relates to an adhesive sheet laminate which comprises a substrate layer composed of a thermoplastic resin composition (A) containing a polypropylene-based resin as a main component, an adhesive layer composed of a thermoplastic resin composition (B) containing a specific thermoplastic resin (b) as a main component and having a melt flow rate of 0.1 to 30 g/10 min, and a release layer composed of a thermoplastic resin composition (C) containing a specific thermoplastic resin (c) as a main component and having a melt flow rate of 0.1 to 30 g/10 min, and which has a tensile elastic modulus of 2000 MPa or more.


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