The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2026
Filed:
Mar. 02, 2021
Applicant:
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Inventors:
Takashi Amie, Tokyo, JP;
Takanori Maeda, Tokyo, JP;
Makoto Nanaumi, Tokyo, JP;
Kazuyoshi Satake, Tokyo, JP;
Yoshiyuki Ono, Tokyo, JP;
Yosuke Wada, Tokyo, JP;
Keisuke Wakita, Tokyo, JP;
Assignee:
DAI NIPPON PRINTING CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 17/10 (2006.01); B32B 7/12 (2006.01); B32B 27/36 (2006.01); C03C 17/34 (2006.01); C08J 5/18 (2006.01); C08J 7/046 (2020.01); G02B 1/14 (2015.01); G02B 1/18 (2015.01);
U.S. Cl.
CPC ...
B32B 17/10 (2013.01); B32B 7/12 (2013.01); B32B 27/36 (2013.01); C03C 17/3405 (2013.01); C08J 5/18 (2013.01); C08J 7/046 (2020.01); G02B 1/14 (2015.01); G02B 1/18 (2015.01); B32B 2255/26 (2013.01); B32B 2255/28 (2013.01); B32B 2307/41 (2013.01); B32B 2307/54 (2013.01); B32B 2307/558 (2013.01); B32B 2307/7376 (2023.05); B32B 2457/20 (2013.01); C03C 2217/78 (2013.01); C08J 2379/08 (2013.01);
Abstract
The present disclosure provides a member for a display device comprising: a glass substrate with a thickness of 100 μm or less; and a resin layer placed on one surface side of the glass substrate, a composite elastic modulus of the resin layer is 5.7 GPa or more, and a thickness of the resin layer is 5 μm or more and 60 μm or less.