The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2026

Filed:

Jan. 23, 2024
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventor:

Masayuki Gozu, Ina, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/343 (2017.01); B29C 45/58 (2006.01); B29C 64/209 (2017.01); B29C 64/329 (2017.01); B33Y 30/00 (2015.01); B33Y 40/10 (2020.01); B33Y 50/02 (2015.01);
U.S. Cl.
CPC ...
B29C 64/343 (2017.08); B29C 64/329 (2017.08); B33Y 30/00 (2014.12); B33Y 40/10 (2020.01); B33Y 50/02 (2014.12); B29C 45/58 (2013.01); B29C 64/209 (2017.08);
Abstract

A plasticizing device includes a material storage section having a first input port and a second input port and storing plasticization material; a plasticizing section having a supply port to which the plasticization material is supplied and plasticizing at least part of the plasticization material to generate a molding material; a connecting pipe having a connecting path connecting the first and the second input port to the supply port; and a controller, wherein the material storage section includes a first supply mechanism configured to adjust the supply amount of the plasticization material from the first input port to the connecting path and a second supply mechanism configured to adjust the supply amount of the plasticization material from the second input port to the connecting path and the controller controls at least one of the first and the second supply mechanism to supply the plasticization material to the connecting path.


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