The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2026

Filed:

Aug. 11, 2023
Applicant:

Acelorex, Inc., Penfield, NY (US);

Inventor:

Brendan Casey, Webster, NY (US);

Assignee:

Acelorex, Inc., Penfield, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/147 (2017.01); B29C 35/08 (2006.01); B29C 64/153 (2017.01); B29C 64/188 (2017.01); B29C 64/236 (2017.01); B29C 64/245 (2017.01); B29C 64/295 (2017.01); B29C 64/35 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 40/20 (2020.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
B29C 64/245 (2017.08); B29C 35/0805 (2013.01); B29C 64/147 (2017.08); B29C 64/153 (2017.08); B29C 64/188 (2017.08); B29C 64/236 (2017.08); B29C 64/295 (2017.08); B29C 64/35 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/20 (2020.01); B29C 2035/0827 (2013.01); B29C 2791/009 (2013.01); B29C 2793/0027 (2013.01); B29C 2793/0081 (2013.01); B29K 2313/00 (2013.01);
Abstract

A method for creating three-dimensional object and a three-dimensional printing system (a) provide a substrate; (b) provide construction material to coat the substrate; (c) curie a portion of the construction material on the substrate to create an object on the substrate; (d) remove excess construction material from the substrate; (e) cut an outline around the object created on the substrate; (f) repeating (a)-(e) until a desired number of substrates with an object created thereon have been processed; (g) stack the processed substrates; and (h) finish the stacked processed substrates to bond the stacked processed substrates together.


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