The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2026
Filed:
Feb. 08, 2021
Senju Metal Industry Co., Ltd., Tokyo, JP;
Yuuki Iijima, Tokyo, JP;
Shunsaku Yoshikawa, Tokyo, JP;
Takashi Saito, Tokyo, JP;
Kanta Dei, Tokyo, JP;
Takahiro Matsufuji, Tokyo, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Abstract
Provided are a lead-free and antimony-free solder alloy, a solder ball, and a solder joint, which have improved shear strength obtained by grain minuteness at a bonded interface and can suppress fusion failure. The lead-free and antimony-free solder alloy has an alloy composition consisting of, by mass %, 0.1 to 4.5% of Ag, 0.20 to 0.85% of Cu, 0.005 to 0.090% of Ni, and 0.0005 to 0.0090% of Ge with the balance being Sn, and the alloy composition satisfies the following relations (1) and (2): 0.006≤(Ag+Cu+Ni)×Ge<0.023 (1), (Sn/Cu)×(Ni×Ge)/(Ni+Ge)<0.89 (2). Ag, Cu, Ni, Ge, and Sn in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.