The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2026
Filed:
Mar. 18, 2022
Applicant:
Trumpf Laser—und Systemtechnik Gmbh, Ditzingen, DE;
Inventors:
Assignee:
TRUMPF LASER—UND SYSTEMTECHNIK GMBH, Ditzingen, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/005 (2006.01); B23K 1/14 (2006.01); B23K 1/19 (2006.01); B23K 101/00 (2006.01); B23K 103/04 (2006.01); B23K 103/16 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0056 (2013.01); B23K 1/14 (2013.01); B23K 1/19 (2013.01); B23K 2101/006 (2018.08); B23K 2103/04 (2018.08); B23K 2103/16 (2018.08);
Abstract
A method for laser soldering includes selecting a copper-containing material as a filler material, supplying the filler material at a butt joint of two components, and melting the filler material in a main process zone by means of laser radiation in an advancement direction. The filler material in the main process zone is melted by means of laser radiation of a wavelength λH in the blue or green spectral range with 400 nm≤λH≤600 nm.