The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2026

Filed:

Dec. 03, 2021
Applicant:

Ethicon, Inc., Raritan, NJ (US);

Inventors:

Sridevi Dhanaraj, Raritan, NJ (US);

Salim Ghodbane, Raritan, NJ (US);

Ashley Deanglis, Raritan, NJ (US);

Michael Cardinale, Raritan, NJ (US);

Nicole Smith, Raritan, NJ (US);

Ashwin Viswanath, Raritan, NJ (US);

Assignee:

Ethicon, Inc., Raritan, NJ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
A61L 24/04 (2006.01); A61L 24/00 (2006.01); A61L 24/10 (2006.01);
U.S. Cl.
CPC ...
A61L 24/043 (2013.01); A61L 24/001 (2013.01); A61L 24/108 (2013.01);
Abstract

A method of making a biocompatible composition for sealing tissue includes mixing a first fluid having a first reactive component (e.g., an electrophile) and a second fluid having a second reactive component (e.g., a nucleophile) to form a mixture and expressing the mixture. During expression, a pH modifying fluid (e.g., NaOH) is added to the mixture at a rate that changes. In one embodiment, a higher ratio of the pH modifying fluid is added to the mixture during a first expressing stage and a lower ratio of said pH modifying fluid is added to the mixture during a second expressing stage. During the first expressing stage, a mixing ratio of the pH modifying fluid, the first fluid and the second fluid is 0.7-1.4:1:1. During the second expressing stage, the mixing ratio of the pH modifying fluid, the first fluid and the second fluid is 0.12-0.24:1:1.


Find Patent Forward Citations

Loading…