The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
Jul. 25, 2023
Chip stacking structure and preparation method thereof, chip stacking package, and electronic device
Huawei Technologies Co., Ltd., Shenzhen, CN;
HUAWEI TECHNOLOGIES CO., LTD., Shenzhen, CN;
Abstract
A chip stacking structure includes: a first chip, a second chip stacked with the first chip, a first redistribution layer, a second redistribution layer, a third redistribution layer, a first conductive channel, and a second conductive channel; the first redistribution layer is disposed on a surface of the first chip facing the second chip; the second redistribution layer is disposed on a passive surface of the second chip, and the third redistribution layer is disposed on an active surface of the second chip; the first conductive channel passes through the second chip and the third redistribution layer, connecting the first redistribution layer and the second redistribution layer; and the second conductive channel passes through the second chip, connecting the second redistribution layer and the third redistribution layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile