The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

Nov. 30, 2022
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventors:

Shinya Arai, Yokkaichi, JP;

Yuta Taguchi, Yokkaichi, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 24/09 (2013.01); H01L 24/08 (2013.01); H01L 25/0657 (2013.01); H01L 2224/0801 (2013.01); H01L 2224/08055 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/0903 (2013.01); H01L 2224/09051 (2013.01); H01L 2224/09132 (2013.01); H01L 2224/09133 (2013.01); H01L 2224/09179 (2013.01); H01L 2224/09515 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06593 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1438 (2013.01); H01L 2924/30205 (2013.01);
Abstract

According to an embodiment, a semiconductor device includes a first chip including a substrate, and a second chip bonded to the first chip at a first surface. Each of the first chip and the second chip includes an element region, and an end region including a chip end portion. The first chip includes a plurality of first electrodes that are arranged on the first surface in the end region and are in an electrically uncoupled state. The second chip includes a plurality of second electrodes that are arranged on the first surface in the end region, are in an electrically uncoupled state, and are respectively in contact with the first electrodes.


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