The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

Oct. 23, 2020
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Masaki Kurachi, Tokyo, JP;

Tatsuya Kawase, Tokyo, JP;

Kentaro Yoshida, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/043 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/043 (2013.01); H01L 21/4807 (2013.01); H01L 21/4817 (2013.01); H01L 23/3735 (2013.01); H01L 24/32 (2013.01); H01L 24/40 (2013.01); H01L 24/73 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/40139 (2013.01); H01L 2224/73263 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/3512 (2013.01);
Abstract

A semiconductor apparatus includes: a base plate; an insulating circuit board including a ceramic substrate, a circuit pattern formed on an upper surface of the ceramic substrate, a metal layer formed on a lower surface of the ceramic substrate and fixed on an upper surface of the base plate with a first joint material; a semiconductor device having a first surface fixed on the circuit pattern with a second joint material and a second surface which is an opposite surface of the first surface; a lead frame fixed on the second surface with a third joint material; and a case fixed to an outer edge portion of the base plate and enclosing the semiconductor device, wherein restoring force acts on the insulating circuit board in a direction of warpage that is convex upward, and restoring force acts on the base plate in a direction of warpage that is convex downward.


Find Patent Forward Citations

Kurachi, Masaki. (2026). Semiconductor apparatus and method for manufacturing semiconductor apparatus (U.S. Patent No. 12575445). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12575445

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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