The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
Mar. 05, 2021
Sony Group Corporation, Tokyo, JP;
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Shigekazu Ishii, Kanagawa, JP;
Bernadette Elliott-Bowman, Lausanne, CH;
Christopher Wright, London, GB;
Timothy Beard, Lausanne, CH;
Matthew Lawrenson, Lausanne, CH;
Hirotaka Kobayashi, Tokyo, JP;
Hiroyuki Shigeta, Kanagawa, JP;
Sony Group Corporation, Tokyo, JP;
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Abstract
A region of a sealing part is effectively utilized. A semiconductor device includes a semiconductor element, a substrate, a sealing part, and a cavity region. The substrate included in this semiconductor device is disposed adjacent to a bottom surface of the semiconductor element. The sealing part included in this semiconductor device is formed in a shape that covers an upper surface that is a surface facing the bottom surface of the semiconductor element, and seals the semiconductor element. The cavity region included in this semiconductor device is a region disposed in the sealing part and formed with a cavity.