The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
Jul. 06, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Sangwook Park, Hwaseong-si, KR;
Sangnam Jeong, Hwaseong-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a wiring board including at least one pair of connection structures electrically connecting at least one pair of differential signal transmission lines and at least one pair of differential signal transmission terminals, respectively. The at least one pair of connection structures includes first via structures staggered in a vertical direction, at least one first connection line electrically connecting the first via structures, second via structures staggered in the vertical direction, and at least one second connection line electrically connecting the second via structures. The at least one first connection line is spaced apart from the at least one second connection line in the vertical direction and electrically insulated therefrom, and intersects the at least one second connection line in the vertical direction.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile