The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

Oct. 10, 2019
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Meysam Moallem, Plano, TX (US);

Michael Paul Pierce, Allen, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/16 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/16 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/562 (2013.01); H01Q 1/2283 (2013.01); H01L 2223/6677 (2013.01);
Abstract

A package includes a substrate, a conductive layer on a first surface of the substrate forming a set of antennas, and a semiconductor die forming communication channels for the antennas, each of the communication channels being electrically coupled to the antennas by way of a redistribution layer that includes the substrate, the semiconductor die being mounted on either the first surface or an opposing second surface of the substrate. The package further includes a set of electrical contacts on the second surface of the substrate, the redistribution layer further coupling the set of electrical contacts to the semiconductor die. The package further includes a stiffening layer over the first surface of the substrate, the stiffening layer forming gaps over the antennas such that the antennas are on an outer surface of the package.


Find Patent Forward Citations

Moallem, Meysam. (2026). Semiconductor package with antenna (U.S. Patent No. 12575422). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12575422

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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