The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
May. 27, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a first semiconductor chip, a second semiconductor chip disposed on the first semiconductor chip, a chip connection terminal configured to electrically connect the first semiconductor chip to the second semiconductor chip, an underfill layer disposed between the first semiconductor chip and the second semiconductor chip and surrounding the chip connection terminal, a vertical porous structure filling spaces of a plurality of vertical cooling channels passing through the first semiconductor chip, the second semiconductor chip, and the underfill layer in a vertical direction, and having a plurality of cooling holes, and a cooling fluid provided to the plurality of cooling holes of the vertical porous structure to flow inside the plurality of vertical cooling channels.