The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

Apr. 16, 2025
Applicant:

Commissariat À L'énergie Atomique ET Aux Énergies Alternatives, Paris, FR;

Inventors:

Pierre Montmeat, Grenoble, FR;

Franck Fournel, Grenoble, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/3065 (2006.01); H01L 21/308 (2006.01); H01L 21/78 (2006.01); H10P 50/00 (2026.01); H10P 50/24 (2026.01); H10P 54/00 (2026.01); H10P 72/70 (2026.01);
U.S. Cl.
CPC ...
H10P 72/7402 (2026.01); H10P 50/242 (2026.01); H10P 50/695 (2026.01); H10P 54/00 (2026.01); H10P 72/74 (2026.01); H10P 72/7434 (2026.01); H10P 72/744 (2026.01);
Abstract

A method of preparing a structured substrate of interest including the following steps: providing a substrate of interest including a thin film, onto which a protective layer has been bonded by direct bonding, depositing a resin, and etching the thin film and a portion of the support substrate through openings in the resin, to form pads, bonding a temporary substrate to the substrate of interest, then separating them, whereby the protective layer is separated from the substrate of interest, the resin being removed prior to the bonding step or during the separation, the protective layer/thin film adhesion energy being lower than the temporary substrate/protective layer adhesion energy or than the resin/protective layer adhesion energy.


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