The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
May. 10, 2022
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); C08L 29/04 (2006.01); C08L 39/06 (2006.01); C08L 75/04 (2006.01); C09J 133/08 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H10D 84/01 (2025.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); C08L 29/04 (2013.01); C08L 39/06 (2013.01); C08L 75/04 (2013.01); C09J 133/08 (2013.01); H01L 24/80 (2013.01); H01L 24/95 (2013.01); H10D 84/01 (2025.01); H01L 24/08 (2013.01); H01L 24/94 (2013.01); H01L 25/0657 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/6834 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2224/95001 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01);
Abstract
A method includes preparing a protective film including a base film and a protective layer laminated on a surface of the base film, mounting the protective film on a semiconductor wafer having a rear surface attached to a dicing tape and a front surface positioned opposite to the rear surface, the protective layer being disposed on the front surface, irradiating the rear surface of the semiconductor wafer with a dicing laser, removing the base film of the protective film from the semiconductor wafer, dividing the semiconductor wafer into individual semiconductor chips, and removing the protective layer from the individual semiconductor chips.