The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

Jul. 28, 2023
Applicant:

Screen Holdings Co., Ltd., Kyoto, JP;

Inventor:

Hikaru Kawarazaki, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/32 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01L 21/32134 (2013.01);
Abstract

A substrate processing method includes a first oxidation step of heating a substrate at a first temperature by irradiation of light of a first intensity while supplying an oxygen gas or an ozone gas to the substrate, a first etching step of supplying an etching liquid to the substrate to make a surface layer of a molybdenum film that changed to molybdenum trioxide dissolve in the etching liquid, a second oxidation step of heating the substrate at a second temperature by irradiation of light of a second intensity while supplying the oxygen gas or the ozone gas to the substrate, and a second etching step of supplying the etching liquid to the substrate to make the surface layer of the molybdenum film that changed to the molybdenum trioxide dissolve in the etching liquid.


Find Patent Forward Citations

Kawarazaki, Hikaru. (2026). Substrate processing method and substrate processing apparatus (U.S. Patent No. 12575354). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12575354

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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