The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

May. 05, 2022
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Jaeweon Hur, Yongin-si, KR;

Seulong Kim, Yongin-si, KR;

Hyein Jeong, Yongin-si, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); C07F 9/6568 (2006.01); C09K 11/06 (2006.01); H10K 85/60 (2023.01); H10K 50/165 (2023.01); H10K 59/123 (2023.01);
U.S. Cl.
CPC ...
H10K 85/657 (2023.02); C07F 9/65685 (2013.01); C09K 11/06 (2013.01); C09K 2211/1018 (2013.01); H10K 50/165 (2023.02); H10K 59/123 (2023.02);
Abstract

A light-emitting device includes a first electrode, a second electrode facing the first electrode, and an interlayer including an emission layer between the first electrode and the second electrode and an electron transport region between the emission layer and the second electrode. The electron transport region includes an electron transport layer and an electron injection layer between the electron transport layer and the second electrode. The electron transport layer includes a first material and a second material, the electron injection layer includes a third material and a fourth material, and an amount of the third material is in a range of about 50 parts by weight to about 99 parts by weight, based on a total of 100 parts by weight of the electron injection layer. The first material to the fourth material are respectively the same as described in the specification.


Find Patent Forward Citations

Loading…