The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

May. 17, 2021
Applicants:

Hefei Xinsheng Optoelectronics Technology Co., Ltd., Hefei, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Xiaodong Xie, Beijing, CN;

Min He, Beijing, CN;

Jing Wang, Beijing, CN;

Tianyu Zhang, Beijing, CN;

Xue Zhao, Beijing, CN;

Tengfei Zhong, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/857 (2025.01); H01L 25/075 (2006.01); H10H 20/01 (2025.01);
U.S. Cl.
CPC ...
H10H 20/857 (2025.01); H01L 25/0753 (2013.01); H10H 20/01 (2025.01); H10H 20/0364 (2025.01);
Abstract

A light-emitting substrate and a manufacturing method thereof, and a display device are provided. The manufacturing method includes: providing a base substrate; forming a first conductive pattern on the base substrate using a first mask; forming a first insulating layer on the first conductive pattern using a second mask, to form a first via hole and a second via hole; forming a second conductive pattern on the first insulating layer using the first mask, the second conductive pattern being electrically connected to the first conductive pattern through the first via hole and the second via hole; forming a second insulating layer on the second conductive pattern using the second mask, to form a third via hole; and forming a third conductive pattern on the second insulating layer using a third mask, the third conductive pattern being electrically connected to the second conductive pattern through the third via hole.


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