The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
Jun. 07, 2022
Applicant:
Xiamen San'an Optoelectronics Co., Ltd., Xiamen City, CN;
Inventors:
Jiangbin Zeng, Xiamen City, CN;
Anhe He, Xiamen City, CN;
Kangwei Peng, Xiamen City, CN;
Suhui Lin, Xiamen City, CN;
Chung-Ying Chang, Xiamen City, CN;
Peng Liu, Xiamen City, CN;
Yu Zhan, Xiamen City, CN;
Chao Lu, Xiamen City, CN;
Qing Wang, Xiamen City, CN;
Lingyuan Hong, Xiamen City, CN;
Assignee:
XIAMEN SAN'AN OPTOELECTRONICS CO., LTD., Xiamen City, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/83 (2025.01); H10H 20/831 (2025.01); H10H 20/832 (2025.01); H10H 20/01 (2025.01); H10H 20/814 (2025.01);
U.S. Cl.
CPC ...
H10H 20/835 (2025.01); H10H 20/8312 (2025.01); H10H 20/01335 (2025.01); H10H 20/032 (2025.01); H10H 20/814 (2025.01);
Abstract
The present disclosure provides a light-emitting diode chip, which includes a substrate, an epitaxial structure, an electrode metal layer, and a eutectic metal layer. The eutectic metal layer has an elongation greater than that of the electrode metal layer, and a hardness less than that of the electrode metal layer.