The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
Oct. 08, 2021
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Kentaro Akiyama, Kanagawa, JP;
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Abstract
Bonding strength of a connection portion bonded to a semiconductor element is measured. The semiconductor element includes a semiconductor substrate and a bond pad. In the semiconductor substrate, an element is formed, and a wiring region having a wiring for transmitting a signal of the element is disposed adjacent. The bond pad is disposed in the wiring region adjacent to a semiconductor substrate removal region, which is a region where the semiconductor substrate is removed, connected to the wiring, and bonded with a connection portion for connection to an outside. The semiconductor substrate removal region includes a region for measuring bonding strength of the bond pad and the connection portion.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile