The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
Dec. 19, 2022
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Youngki Jung, Suwon-si, KR;
Sangmin Shin, Suwon-si, KR;
Kisun Kang, Suwon-si, KR;
Donghwan Kim, Suwon-si, KR;
Chulgyu Jung, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 86/60 (2025.01); G09G 3/32 (2016.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01); H10D 86/40 (2025.01);
U.S. Cl.
CPC ...
H10D 86/60 (2025.01); G09G 3/32 (2013.01); H01L 25/167 (2013.01); H10D 86/441 (2025.01); G09G 2300/0426 (2013.01); H01L 24/05 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05688 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83851 (2013.01);
Abstract
A light-emitting diode (LED) module includes: a glass substrate; a signal wiring layer provided on the glass substrate and including a plurality of electrodes connected by a passive matrix circuit; and a plurality of LEDs connected to the plurality of electrodes and configured to emit light toward the glass substrate, wherein the signal wiring layer further includes a boundary region that divides the LED module into a plurality of unit regions.