The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
Oct. 17, 2023
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 3/30 (2006.01); H05K 3/36 (2006.01); H05K 5/00 (2025.01); H05K 7/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/145 (2013.01); H05K 1/112 (2013.01); H05K 1/117 (2013.01); H05K 1/144 (2013.01); H05K 3/301 (2013.01); H05K 3/36 (2013.01); H05K 2201/10689 (2013.01); H05K 2201/2009 (2013.01); H05K 2203/304 (2013.01);
Abstract
A connecting board according to an embodiment includes a core layer having a cavity in a thickness direction to pass through an inner center region of the core layer based on a plane perpendicular to the thickness direction, a via passing through the core layer, and connection pads that are coupled to both ends of the via. The core layer includes coupling ribs which protrude from an inner surface of the core layer facing the cavity toward the cavity.