The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
Apr. 22, 2024
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Young Kuk Ko, Suwon-si, KR;
Sang Hoon Kim, Suwon-si, KR;
Ji Ho Yoon, Suwon-si, KR;
Gyu Mook Kim, Suwon-si, KR;
Tae Hun Kim, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A printed circuit board includes: a first insulating layer; a cavity unit including a first cavity penetrating through a portion of the first insulating layer from an upper surface thereof in a thickness direction, and a second cavity penetrating through another portion of the first insulating layer from the first cavity; a first wiring layer disposed at an upper side of the first insulating layer; a second wiring layer disposed at a lower side of the first insulating layer; and a third wiring layer at least partially buried in the first insulating layer and disposed on a level between the first and second wiring layers in the thickness direction. The third wiring layer includes pads in which at least a portion of each of upper surfaces thereof is exposed from the first insulating layer through the cavity unit, and the first cavity has a wider cross-section than the second cavity.