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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12574452 B1

PDFFull Text
Date of Patent:
Mar. 10, 2026

Filed:

Feb. 23, 2023

Electronic device including circuit board assembly

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Gyuyeon Jeon, Suwon-si, KR;

Jehyun Son, Suwon-si, KR;

Youngjoon Ahn, Suwon-si, KR;

Minsu Rhee, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

NIXON & VANDERHYE P.C.

Primary Examiner:

Binh B Tran

Int. Cl.
CPC ...
H05K 1/11 (2006.01); H04M 1/02 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 1/181 (2026.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H04M 1/0277 (2013.01); H05K 1/02 (2013.01); H05K 1/0218 (2013.01); H05K 1/11 (2013.01); H05K 1/111 (2013.01); H05K 1/142 (2013.01); H05K 1/18 (2013.01); H05K 1/181 (2013.01); H05K 9/0081 (2013.01);
Abstract

According to an example embodiment of the disclosure, an electronic device may include a first printed circuit board, a second printed circuit board, multiple first conductive portions, multiple second conductive portions, and multiple third conductive portions. The second printed circuit board may be disposed to at least partially overlap the first printed circuit board. The multiple first conductive portions may be arranged in a first area between the first printed circuit board and the second printed circuit board. The multiple first conductive portions may electrically and mechanically connect the first printed circuit board and the second printed circuit board. The multiple second conductive portions may be arranged in a second area, surrounding at least a part of the first area, between the first printed circuit board and the second printed circuit board. The multiple second conductive portions may electrically and mechanically connect the first printed circuit board and the second printed circuit board. The multiple third conductive portions may be arranged in the second area. The multiple third conductive portions may electrically connect at least two of the multiple second conductive portions. The multiple second conductive portions may electrically connect a first ground area included in the first printed circuit board and a second ground area included in the second printed circuit board.

Find Patent Forward Citations

Jeon, Gyuyeon. (2026). Electronic device including circuit board assembly (U.S. Patent No. 12574452). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12574452

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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