The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

Jun. 23, 2023
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Cheng-Fan Wei, New Taipei City, TW;

Chao-Kuei Chang, Taipei City, TW;

Yi-Hsiang Kung, Taipei, TW;

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 1/02 (2006.01); H01Q 1/44 (2006.01); H01Q 21/08 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2266 (2013.01); H01Q 1/02 (2013.01); H01Q 1/44 (2013.01); H01Q 21/08 (2013.01);
Abstract

Aspects described herein include millimeter wave integrated hinges. In one aspect, wireless communication apparatus includes a bracket, a first pivot structure attached to the bracket configured to pivot the bracket around a first line, and a second pivot structure attached to the bracket and configured to pivot the bracket around a second line, wherein the second line is parallel to the first line. A millimeter wave antenna array is mounted to the bracket such that the mmW antenna array is positioned between the first line and the second line.


Find Patent Forward Citations

Wei, Cheng-Fan. (2026). Millimeter wave (mmw) integrated hinge (U.S. Patent No. 12573743). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12573743

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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