The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

Dec. 18, 2019
Applicant:

Cellmo Materials Innovation, Inc., Berkeley, CA (US);

Inventors:

Gigap Han, Chungcheongnam-do, KR;

Hyeji Park, Seoul, KR;

Kicheol Hong, Busan, KR;

Heeman Choe, Walnut Creek, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/80 (2006.01); B22F 3/11 (2006.01); C22C 1/08 (2006.01); C22C 3/00 (2006.01); C22C 9/01 (2006.01); C22C 21/12 (2006.01); C23C 10/36 (2006.01); C23C 10/38 (2006.01); C23C 10/44 (2006.01); C23C 10/48 (2006.01); H01M 4/134 (2010.01); H01M 4/38 (2006.01); H01M 4/66 (2006.01); H01M 10/0525 (2010.01);
U.S. Cl.
CPC ...
H01M 4/808 (2013.01); C22C 1/08 (2013.01); C22C 3/00 (2013.01); C22C 9/01 (2013.01); C22C 21/12 (2013.01); C23C 10/36 (2013.01); C23C 10/38 (2013.01); C23C 10/44 (2013.01); C23C 10/48 (2013.01); H01M 4/134 (2013.01); H01M 4/387 (2013.01); H01M 4/661 (2013.01); H01M 10/0525 (2013.01); B22F 3/1103 (2013.01); B22F 2998/10 (2013.01);
Abstract

A facile method is based on a pack-cementation process using large-area copper foil instead of copper powder. By controlling a pack-cementation time and an amount of alloying element (e.g., aluminum), a hierarchical microporous or nanoporous copper can be created. When coated with tin active material, the hierarchical microporous or nanoporous copper can be used as an advanced lithium-ion battery anode. A coin-cell test exhibited a four-fold higher areal capacity (e.g., 7.4 milliamp-hours per square centimeter without any performance degradation up to 20 cycles) as compared to a traditional graphite anode.


Find Patent Forward Citations

Han, Gigap. (2026). Large-area copper nanofoam with hierarchical structure for use as electrode (U.S. Patent No. 12573639). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12573639

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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