Plasma processing apparatus and method of adjusting the same

Abstract

Disclosed are a plasma processing apparatus and an adjusting method of the same. The apparatus includes: a vacuum chamber enclosed by a chamber body and a chamber lid; a movable upper electrode assembly disposed in the vacuum chamber; a bottom electrode assembly, arranged opposite the movable upper electrode assembly, the bottom electrode assembling being detachably connected with the bottom of the chamber body; a plurality of self-alignment devices each including a self-alignment upper structure and a self-alignment lower structure, the self-alignment upper structure and the self-alignment lower structure being connected to the movable upper electrode assembly and the bottom electrode assembly, respectively, wherein when the self-alignment upper structures and the self-alignment bottom structures are aligned to be jointed together, the center of the movable upper electrode assembly is aligned with that of the bottom electrode assembly. The disclosure offers the following advantages: through cooperation between the self-alignment upper structures and the self-alignment lower structures, the plasma processing apparatus realizes concentricity adjustment between the movable upper electrode assembly and the lower electrode assembly, rendering the self-alignment devices simple in structure and convenient to operate and alleviating testing pressures on operators.