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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12573593 B1

PDFFull Text
Date of Patent:
Mar. 10, 2026

Filed:

Feb. 10, 2020

Plasma processing method

Applicant:

Hitachi High-tech Corporation, Tokyo, JP;

Inventors:

Kosa Hirota, Tokyo, JP;

Masahiro Sumiya, Tokyo, JP;

Hirofumi Eitoku, Tokyo, JP;

Takanori Nakatsuka, Tokyo, JP;

Assignee:

Hitachi High-Tech Corporation, Tokyo, JP;

Attorney:

Miles & Stockbridge, P.C.

Primary Examiner:

Stephanie P Duclair

Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32477 (2013.01); H01J 37/32449 (2013.01); H01J 37/32862 (2013.01); H01J 2237/334 (2013.01); H01L 21/3065 (2013.01);
Abstract

A plasma processing method which can realize a reduction of process variation in the first one of lot processing includes a first step of supplying gas to a processing chamber and a second step of etching the sample by using plasma after the first step. The gas is a gas containing a carbon element and a hydrogen element, a gas containing a chlorine element, or a mixed gas containing all of the gases used in the second step.

Find Patent Forward Citations

Hirota, Kosa. (2026). Plasma processing method (U.S. Patent No. 12573593). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12573593

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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