The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

Apr. 14, 2023
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Jin Bok Shin, Suwon-si, KR;

Min Soo Kim, Suwon-si, KR;

Choong Seop Jeon, Suwon-si, KR;

Jung Hyun An, Suwon-si, KR;

Seung Yong Lee, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/224 (2006.01); H01G 4/12 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01G 4/224 (2013.01); H01G 4/1227 (2013.01); H01G 4/30 (2013.01);
Abstract

A multilayer electronic includes a body including a permeation layer disposed inside the body and in contact with a surface of the body, a dielectric layer, and internal electrodes and external electrodes disposed on the body, wherein an average content of subcomponent element included in the permeation layer is higher than an average content of subcomponent elements included in the dielectric layer, and an average surface roughness of the body is 0.01 nm or more and 40 nm or less.


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