The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

Dec. 01, 2023
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Moon Kyung Hwang, Suwon-si, KR;

Moon Soo Park, Suwon-si, KR;

Seung Hyun Noh, Suwon-si, KR;

Jin Woo Kim, Suwon-si, KR;

Chung Hwan Kim, Suwon-si, KR;

Hyun Woo Kim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/005 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01);
U.S. Cl.
CPC ...
H01G 4/1227 (2013.01); H01G 4/005 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01);
Abstract

The present disclosure provides a multilayer electronic component which may improve a break down voltage (BDV) characteristic by adjusting a ratio of a content of an element included in a first or second region of a dielectric layer to reduce a difference in dielectric grain size dispersion and grain density in the first or second region.


Find Patent Forward Citations

Hwang, Moon. (2026). Multilayer electronic component (U.S. Patent No. 12573556). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12573556

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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