The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

Nov. 01, 2024
Applicant:

Rebellions Inc., Seongnam-si, KR;

Inventors:

Young-Jae Jin, Seongnam-si, KR;

Miock Chi, Seongnam-si, KR;

Assignee:

REBELLIONS INC., Seongnam-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 11/00 (2006.01); G06F 11/30 (2006.01); G06F 11/34 (2006.01); G06F 13/14 (2006.01); G06F 13/16 (2006.01); G06F 13/28 (2006.01); G06F 13/36 (2006.01); G06F 13/40 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
G06F 13/4068 (2013.01); G06F 11/3006 (2013.01); G06F 11/3051 (2013.01); G06F 11/348 (2013.01); G06F 13/14 (2013.01); G06F 13/1673 (2013.01); G06F 13/28 (2013.01); G06F 13/36 (2013.01); G06F 13/4031 (2013.01); G06F 13/409 (2013.01); H01L 23/5382 (2013.01); H01L 23/5385 (2013.01); H01L 25/0655 (2013.01); G06F 2213/0026 (2013.01); G06F 2213/40 (2013.01);
Abstract

Provided is an electronic device, including a first chiplet including a system bus, a first interconnect module, and a second interconnect module, and a second chiplet connected to the first chiplet through at least one of a first interconnect interface connected to the first interconnect module or second interconnect interface connected to the second interconnect module, in which, in response to determining that a communication failure occurs between the first chiplet and the second chiplet, at least a part of a transfer path through which information is transmitted from the first chiplet to the second chiplet is changed.


Find Patent Forward Citations

Jin, Young-Jae. (2026). Electronic device having a plurality of chiplets (U.S. Patent No. 12572493). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12572493

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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