The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

Jul. 14, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Dongheon Jang, Suwon-si, KR;

Junghyun Kang, Suwon-si, KR;

Taegyun Kim, Suwon-si, KR;

Sanghwa Lee, Suwon-si, KR;

Seongho Hong, Suwon-si, KR;

Chungsoon Park, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); A61B 5/00 (2006.01); F16F 15/04 (2006.01); G04G 17/04 (2006.01); H04R 1/28 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 1/181 (2026.01);
U.S. Cl.
CPC ...
G06F 1/1658 (2013.01); A61B 5/00 (2013.01); F16F 15/04 (2013.01); G04G 17/04 (2013.01); G06F 1/16 (2013.01); G06F 1/163 (2013.01); H04R 1/2876 (2013.01); H05K 1/0271 (2013.01); H05K 1/181 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10151 (2013.01);
Abstract

A wearable electronic device is provided. The wearable device includes a bracket, a printed circuit board that at least partially faces a first surface of the bracket, a sound sensor structure disposed on a second surface of the bracket, a biometric sensor structure that overlaps the first surface of the bracket with respect to a direction that is perpendicular to the printed circuit board and a damping structure interposed between the biometric sensor structure and the printed circuit board. The damping structure may elastically support the biometric sensor structure and the printed circuit board.


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