The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

Sep. 12, 2023
Applicant:

Schneider Electric Usa, Inc., Andover, MA (US);

Inventors:

Adrian Abdala Rendon Hernandez, Tiffin, IA (US);

Juan Ignacio Melecio Ramirez, North Liberty, IA (US);

Collin Richard Fischels, Independence, IA (US);

Austin Derby, Cedar Rapids, IA (US);

Assignee:

Schneider Electric USA, Inc., Boston, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 15/18 (2006.01); G01R 19/00 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
G01R 15/181 (2013.01); G01R 19/0092 (2013.01); H05K 1/115 (2013.01); H05K 1/165 (2013.01);
Abstract

Systems and methods for sensing current provide a Rogowski coil type current sensor for a current flow monitoring device in which the coil windings are formed by electrically conductive traces on a printed circuit board (PCB) substrate. Each coil winding is composed of two or more elongate traces formed on a PCB substrate and extending radially outward from a central opening or hole in the PCB substrate. Each trace coil winding is connected to electrically conductive vias, one via at each end of the trace. The via at one end connects the trace to another trace in coil winding, while the via at the other end connects the trace to a different trace in the same coil winding or an adjacent coil winding. The result is a conductive helix encircling the central opening in the PCB substrate that electrically resembles a Rogowski coil.


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