The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

Mar. 30, 2022
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Anwar Hegazi, Erfurt, DE;

Joerg Siedentopf, Untergruppenbach, DE;

Robert Remus, Mundelsheim, DE;

Peter Huendorf, Eisenach, DE;

Thomas Breinlinger, Isny, DE;

Bernd Lutz, Kempten, DE;

Heiko Rausch, Gotha, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01P 3/42 (2006.01); G01D 11/24 (2006.01); G01D 11/30 (2006.01); G01P 1/02 (2006.01);
U.S. Cl.
CPC ...
G01D 11/245 (2013.01); G01D 11/30 (2013.01); G01P 1/026 (2013.01);
Abstract

A sensor unit includes at least one sensor and at least two busbars. The busbars have first ends forming an internal electric interface for contacting the sensor and second ends forming an external electric interface for a connection cable or a plug receiving area. An injection-molded plastic housing defines the outer shape of the sensor unit and forms a sensor receiving area with a through-opening, which holds the sensor. The housing partly encases the busbars such that the internal electric interface is at least partly free and accessible near the sensor receiving area and the external electric interface is formed within the housing. The sensor and the internal electric interface are surrounded by a potting compound in a media-tight manner to form a sealed sensor head. The potting compound is formed of a material that can be processed at lower pressures and/or temperatures than the plastic material of the housing.


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