The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

May. 06, 2022
Applicant:

Kyowa Chemical Industry Co., Ltd., Takamatsu, JP;

Inventors:

Phuong Nguyen Duy Dao, Sakaide, JP;

Tsukasa Nakamura, Sakaide, JP;

Assignee:

SETOLAS HOLDINGS, INC., Takamatsu, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C01B 33/142 (2006.01); C01B 33/193 (2006.01); C08K 3/34 (2006.01); C08K 7/26 (2006.01); C08L 101/00 (2006.01); C08K 3/36 (2006.01);
U.S. Cl.
CPC ...
C01B 33/142 (2013.01); C08K 7/26 (2013.01); C01P 2004/03 (2013.01); C01P 2004/34 (2013.01); C01P 2004/51 (2013.01); C01P 2004/61 (2013.01); C01P 2004/62 (2013.01); C01P 2006/12 (2013.01); C01P 2006/14 (2013.01); C08K 2201/003 (2013.01); C08K 2201/006 (2013.01);
Abstract

Provided is a hollow particle, including silica, having a Dof primary particles that satisfies the following expression (1), and having a breaking strength of 10 MPa or more: 1≤D≤1.5 . . . (1) where D=D/D, and Dand Drepresent a 25th value and a 75th value, respectively, when long diameters of 100 randomly selected primary particles are measured in observation with a scanning electron microscope and sorted in order of increasing size.


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Dao, Phuong Nguyen Duy. (2026). Hollow particle, method of producing the hollow particle, resin composition, and resin molded product and laminate each using the resin composition (U.S. Patent No. 12570534). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12570534

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