The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

Nov. 22, 2023
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Masato Yoshida, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65G 57/00 (2006.01); B23Q 5/22 (2006.01); B65D 19/44 (2006.01);
U.S. Cl.
CPC ...
B65G 57/005 (2013.01); B23Q 5/22 (2013.01); B65D 19/44 (2013.01);
Abstract

A stackable molded part includes a runner portion that connects a plurality of parts, and a positioning portion that is formed on the runner portion, wherein the positioning portion protrudes in a shape of a column from the runner portion to at least one side in a stacking direction in which molded parts are stacked, wherein an end portion of the positioning portion of the molded part is engageable with an end portion of a positioning portion of another molded part that adjoins the molded part when these molded parts are stacked on top of each other, and wherein the positioning portion protrudes more than the plurality of parts in the stacking direction to the one side of the positioning portion.


Find Patent Forward Citations

Yoshida, Masato. (2026). Molded part, molded part supporting structure, and molded part conveyance method (U.S. Patent No. 12570486). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12570486

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…