Transfer film, transfer method using transfer film and electronic products manufactured using transfer film

Abstract

An embodiment of the present invention provides a transfer film that may be used for both a picking process and a placing process of an element, a transfer method using the transfer film, and an electronic product manufactured using the same. Here, the transfer film according to an embodiment of the present invention includes a base part, an adhesion part, and a first protrusion part. The adhesion part is provided on one surface of the base part, and at least part of the first protrusion part is formed and protruded on one surface of the base part to be accommodated inside the adhesion part, and the thickness increases toward the first direction parallel to the surface of the base part. The first protrusion part is partitioned into a first region including a relatively thick portion of the first protrusion part and a second region including a relatively thin first protrusion part and having weaker adhesive force than the first region, and the element is picked while the first region is lifted first in the picking process, while the element is placed while the second region is lifted first in the placing process.