The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
Jun. 28, 2023
Applicant:
Tamura Corporation, Tokyo, JP;
Inventors:
Takanori Shimazaki, Iruma, JP;
Daisuke Maruyama, Iruma, JP;
Genki Ochi, Iruma, JP;
Masaya Arai, Iruma, JP;
Assignee:
TAMURA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); B23K 35/02 (2006.01); C22C 12/00 (2006.01); C22C 13/02 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 35/025 (2013.01); B23K 35/264 (2013.01); C22C 12/00 (2013.01); C22C 13/02 (2013.01);
Abstract
A solder alloy includes 45 mass % or more and 63 mass % or less of Bi, 0.1 mass % or more and less than 0.7 mass % of Sb, 0.05 mass % or more and 1 mass % or less of In, and a balance including Sn.