The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
Oct. 28, 2020
Applicant:
Mitsui Chemicals, Inc., Tokyo, JP;
Inventors:
Suguru Endo, Ichikawa, JP;
Toshikazu Sakamaki, Tokyo, JP;
Mai Kimura, Sodegaura, JP;
Hiroki Murai, Ichihara, JP;
Takaaki Hayashi, Funabashi, JP;
Assignee:
MITSUI CHEMICALS, INC., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61K 6/62 (2020.01); A61K 6/887 (2020.01); C08F 2/50 (2006.01); C08F 22/02 (2006.01); C08F 22/38 (2006.01); C08F 220/18 (2006.01); C08F 290/06 (2006.01); B33Y 70/00 (2020.01);
U.S. Cl.
CPC ...
A61K 6/62 (2020.01); A61K 6/887 (2020.01); C08F 2/50 (2013.01); C08F 22/02 (2013.01); C08F 22/38 (2013.01); B33Y 70/00 (2014.12); C08F 220/18 (2013.01); C08F 290/067 (2013.01);
Abstract
A photocurable composition includes a (meth)acrylic monomer component and a photopolymerization initiator, wherein an adhesive force of a cured product is less than or equal to 1.5 N, and a rupture elongation of the cured product is greater than or equal to 20%.