The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2026

Filed:

Apr. 18, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Myunghee Kim, Suwon-si, KR;

Youngki Jung, Suwon-si, KR;

Donghwan Kim, Suwon-si, KR;

Yong Namkung, Suwon-si, KR;

Chulgyu Jung, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); H01L 23/00 (2006.01); H10H 20/85 (2025.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 24/02 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/08 (2013.01); H01L 24/24 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/95 (2013.01); H01L 2224/02377 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/05558 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06102 (2013.01); H01L 2224/08147 (2013.01); H01L 2224/24147 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/95101 (2013.01); H01L 2224/95144 (2013.01); H10H 20/85 (2025.01);
Abstract

A display module is disclosed. The display module includes a substrate; a plurality of inorganic light-emitting diodes provided in a plurality of mounting grooves formed in the substrate, the plurality of inorganic light-emitting diodes including an inorganic light-emitting diode that has a first chip electrode and a second chip electrode; a first substrate electrode pad and a second substrate electrode pad provided at a bottom surface of a mounting groove from among the plurality of mounting grooves, the first substrate electrode pad being electrically coupled to the first chip electrode and the second substrate electrode pad being electrically coupled to the second chip electrode; and a third substrate electrode pad and a fourth substrate electrode pad provided around the mounting groove.


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