The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2026
Filed:
Aug. 29, 2023
Applicant:
Nec Corporation, Tokyo, JP;
Inventors:
Assignee:
NEC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/053 (2006.01); H01L 23/498 (2006.01); H01R 12/70 (2011.01); H01R 12/71 (2011.01); H01R 13/24 (2006.01); H10N 69/00 (2023.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/053 (2013.01); H01L 23/49822 (2013.01); H01R 12/7005 (2013.01); H01R 12/714 (2013.01); H01R 13/2421 (2013.01); H10N 69/00 (2023.02); H01L 24/16 (2013.01); H01L 2224/16225 (2013.01);
Abstract
A quantum device includes a quantum chip including a superconducting quantum circuit; an interposer including mounting the quantum chip on a first surface thereof; a housing having openings penetrating from a first surface of the housing opposing a second surface of the interposer to a second surface of the housing with probe pins housed in the opening, a board with a first surface facing the second surface of the housing; and one or more spacers between the first surface of the housing and the second surface of the interposer to ensure a clearance between the first surface of the housing and the second surface of the interposer facing the first surface of the housing.