The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2026
Filed:
Apr. 28, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Gun Lee, Suwon-si, KR;
Jun Woo Myung, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
Provided is a semiconductor package. The semiconductor package may include a first redistribution structure, a first semiconductor chip including a first surface and a second surface, the first surface being disposed to face the first redistribution structure, a second redistribution structure disposed on the second surface of the first semiconductor chip and including a second insulating layer and a second redistribution layer, a first sealing layer disposed between the first and second redistribution structures and configured to cover the second surface of the first semiconductor chip, and a connection structure configured to connect the first and the second redistribution structures, wherein the second redistribution layer includes a first via and a second via on the first via, wherein the first via includes first and second seed layers, and a conductive layer on the second seed layer, and wherein the first sealing layer includes a photosensitive insulating material.