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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12568829 B1

PDFFull Text
Date of Patent:
Mar. 03, 2026

Filed:

Mar. 20, 2023

Packaging device including bumps and method of manufacturing the same

Applicant:

SK Hynix Inc., Icheon-si, KR;

Inventors:

Jae Jun Lee, Icheon-si, KR;

Jong Yeon Kim, Icheon-si, KR;

Jong Hoon Kim, Icheon-si, KR;

Ju Heon Yang, Icheon-si, KR;

Mi Seon Lee, Icheon-si, KR;

Assignee:

SK hynic Inc., Icheon-si, KR;

Attorney:

WILLIAM PARK AND ASSOCIATES LTD.

Primary Examiner:

Laura M Menz

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 21/485 (2013.01); H01L 23/49811 (2013.01); H01L 24/11 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 2224/113 (2013.01); H01L 2224/13007 (2013.01); H01L 2224/13582 (2013.01); H01L 2224/16147 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/17517 (2013.01); H01L 2224/17519 (2013.01); H01L 2924/384 (2013.01);
Abstract

A packaging device including bumps and a method of manufacturing the packaging device are presented. In the method of manufacturing a packaging device, a dielectric layer that covers a packaging base is formed and a lower layer is formed over a packaging base including first and second connecting pads. A plurality of dummy bumps that overlaps with the dielectric layer is formed. A sealing pattern that covers the dummy bumps, filling areas between the dummy bumps, is formed. A lower layer pattern in which the plurality of dummy bumps have been disposed is formed by removing portions of the lower layer that are exposed and do not overlap with the sealing pattern.

Find Patent Forward Citations

Lee, Jae. (2026). Packaging device including bumps and method of manufacturing the same (U.S. Patent No. 12568829). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12568829

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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