The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2026

Filed:

Sep. 08, 2022
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventor:

Akira Nakajima, Yokkaichi Mie, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 21/76813 (2013.01); H01L 21/76816 (2013.01); H01L 21/76819 (2013.01); H01L 21/7684 (2013.01); H01L 21/76843 (2013.01); H01L 21/76895 (2013.01); H01L 23/528 (2013.01);
Abstract

A semiconductor device according to the present embodiment includes a wiring layer including a plurality of wires. The wires include first wires and second wires. Each of the first wires has a first width in a direction substantially parallel to the wiring layer. The second wires are arranged at wider intervals than intervals of the first wires. Each of the second wires includes a first wiring member having a second width larger than the first width, and a second wiring member provided on the first wiring member and having a third width larger than the second width.


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Nakajima, Akira. (2026). Wirings for semiconductor device arranged at different intervals and having different widths (U.S. Patent No. 12568815). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12568815

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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