The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2026
Filed:
Oct. 10, 2023
Applicant:
Zeus Co., Ltd., Hwaseong-si, KR;
Inventors:
Woon Kong, Cheonan-si, KR;
Ji Hoon Song, Cheonan-si, KR;
Ung Jo Moon, Osan-si, KR;
Ji Ho Park, Hwaseong-si, KR;
Won Seok Choi, Hwaseong-si, KR;
Assignee:
ZEUS CO., LTD., Hwaseong-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6838 (2013.01); H01L 21/68721 (2013.01); H01L 21/68764 (2013.01); H01L 21/68728 (2013.01); H01L 2221/68336 (2013.01); Y10T 279/11 (2015.01);
Abstract
A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.
Kong, Woon. (2026). Wafer processing apparatus and wafer processing method (U.S. Patent No. 12568799). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12568799
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile