The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2026

Filed:

Dec. 25, 2020
Applicant:

Sato Holdings Kabushiki Kaisha, Tokyo, JP;

Inventor:

Yoshimitsu Maeda, Tokyo, JP;

Assignee:

SATO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 41/00 (2006.01); H01L 21/463 (2006.01); H01L 21/477 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67115 (2013.01); H01L 21/463 (2013.01); H01L 21/477 (2013.01); H01L 21/67092 (2013.01); H01L 21/67706 (2013.01);
Abstract

The present invention is an IC chip mounting apparatus including: a conveyor configured to convey an antenna continuous body on a conveying surface, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material; an IC chip placement unit configured to place an IC chip on a photo-curable adhesive that is located on a reference position of each antenna in the antenna continuous body; and a light irradiator configured to irradiate, with light, the adhesive of each antenna of the antenna continuous body that is conveyed by the conveyor, wherein the light irradiator is configured to irradiate the adhesive of each antenna with the light, while the IC chip on the adhesive is pressed to the antenna.


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