The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2026

Filed:

Mar. 18, 2022
Applicant:

Gaf Energy Llc, Parsippany, NJ (US);

Inventors:

Dawei Kuo, Fremont, CA (US);

Lewis Abra, San Francisco, CA (US);

Richard Perkins, San Jose, CA (US);

Assignee:

GAF Energy LLC, Parsippany, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 19/80 (2025.01); H02S 40/30 (2014.01); H02S 40/34 (2014.01); H05K 3/00 (2006.01); H10F 77/00 (2025.01);
U.S. Cl.
CPC ...
H10F 19/80 (2025.01); H02S 40/34 (2014.12); H05K 3/0058 (2013.01); H10F 77/935 (2025.01); H02S 40/30 (2014.12); H10F 77/95 (2025.01);
Abstract

Some embodiments of the present disclosure relate to a system. In some embodiments, the system includes a photovoltaic module and a module-level power electronics device electrically connected to the photovoltaic module. In some embodiments, the module-level power electronics device comprises a laminated potted printed circuit board. In some embodiments, the laminated potted printed circuit board comprises a potted printed circuit board and an encapsulant covering the potted printed circuit board. In some embodiments, the potted printed circuit board comprises: a printed circuit board having a top surface, and a pottant covering the top surface of the printed circuit board. In some embodiments, the laminated potted printed circuit board is substantially void-free.


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